IMW institute
Technical and technological preparation
Technical and technological preparation includes complete technical and technological preparation of samples for further testing.
Technological preparation
- Request processing and review
- Work orders
- Modeling and CAD preparation of samples according to standards
Technical preparation
- Manufacture of test specimens for mechanical testing
- Precision cutting of samples
- Preparation of samples for optical emission spectrometer
- Preparation of samples for metallographic testing
Polishing and grinding
- For polishing and grinding, an automatic machine is used that can prepare 6 samples simultaneously with previously set parameters (pressure force, base speed, head speed, etc.).
- For sample preparation, the highest quality consumables are used (sandpaper, pastes and cloths).
precise cutting of samples
- Cutting samples is an important part of the process that precedes polishing and grinding.
- The automatic cutting machine offers the ability to cut from 200 to 5000 rpm with a precision of 0.0001 mm on the X axis and 0.1 mm on the Y axis.
- Different holders allow cutting samples with a circular cross-section of up to 71 mm, as well as other shapes of various dimensions.
- Cutting with the addition of abrasives allows for reduced deformation of the sample surface during cutting.
sample flooding
- Sample embedding can have a significant impact on the efficiency of the grinding and polishing process. Inconsistent mold composition or poor edge retention can negatively affect the process and lead to additional processing time but also additional deformations that can negatively affect further testing.
- The laboratory is equipped with a modern sample embedding system, which enables a safe process of sample preparation for polishing and grinding and metallographic testing.
electrolytic polishing (struers lectropol-5)
- Equipment for electrolytic polishing and etching is widely used in the quality preparation of aluminum samples, where an additional oxide layer is applied for further metallographic testing to determine grain boundaries.
- The device uses 0-100 V/6 A for polishing, 0-25 V/6 A for etching, and 0-15 V/1.5 A for external etching.
